Summary
- Profile Type
- Technology offer
- POD Reference
- TODE20230216008
- Term of Validity
- 16 February 2023 - 15 February 2025
- Company's Country
- Germany
- Type of partnership
- Investment agreement
- Commercial agreement with technical assistance
- Targeted Countries
- All countries
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General information
- Short Summary
- A German university has improved the process for testing integrated circuits in chips. In this process, the tests are performed in parallel and the testing procedure is significantly accelerated. The university is offering both a licensing agreement and technological cooperation agreement.
- Full Description
-
Integrated circuits, or ICs, must be tested – that is the only way to ensure the required functionality. To this end, test structures are added to circuits. They consist of a test data input (TDI) and a test data output (TDO). Conventional test structures apply a test signal to the test data input and route it through all structures. Normally, only one test data input is available, since space is limited. So tests take a long time and are therefore expensive. For safety reasons, many applications require IC self-tests to be performed during operation. Such in-field tests are described in ISO 26262.
The new procedure from a German university offers an efficient solution to this problem: It uses a number of reconfigurable test structures connected with intermediate storage. This allows the tests to be performed concurrently, greatly speeding the test process. The intermediate storage and corresponding individual control units are key here. Test data is compressed to further enhance efficiency.
The university offers chip manufacturers and electrical engineering companies a licensing agreement. If there is interest in further development of the process, the university also offers technological cooperation. - Advantages and Innovations
- The new procedure reduces the test time and chip surface required. It is also easy to integrate into test processes.
- Stage of Development
- Lab tested
- Sustainable Development Goals
- Goal 9: Industry, Innovation and Infrastructure
- IPR status
- IPR granted
- IPR notes
- The German patent was granted by the German Patent and Trade Mark Office. A European patent application and a U.S. patent application have been disclosed.
Partner Sought
- Expected Role of a Partner
- The university offers chip manufacturers and electrical engineering companies a licensing agreement. If there is interest in further development of the process, the university also offers technological cooperation.
- Type and Size of Partner
- SME 11-49
- Big company
- Other
- SME <=10
- SME 50 - 249
- Type of partnership
- Investment agreement
- Commercial agreement with technical assistance
Dissemination
- Technology keywords
- 001001008 - Microengineering,
- 09003 - Electronic measurement systems
- 05005 - Micro- and Nanotechnology
- 01002001 - Micro and Nanotechnology related to Electronics and Microelectronics
- Market keywords
- 03001005 - Microprocessors
- 03004002 - Components testing equipment
- 03007002 - Other measuring devices
- Targeted countries
- All countries
